Apple is expected to release the M5 Pro and M5 Max chips with the next MacBook Pro update in early 2026. Alongside enhancements in clock speeds and core counts, these chips will utilize TSMC’s System on Integrated Chips (SoIC) packaging technology. This change in packaging is reported to help the chips run cooler and faster while also reducing production costs.
The information comes from a recent post by leaker Fixed Focus Digital, who highlighted that the upper-tier M5 chips will adopt this advanced packaging method. SoIC technology allows for more efficient integration of chip components, which can improve thermal management and overall chip performance.
**Why this matters**
The shift to SoIC packaging could represent a significant step forward in Apple Silicon design by enhancing energy efficiency and performance without solely relying on traditional hardware upgrades. This may lead to longer battery life and better sustained performance in future MacBook Pro models, benefiting users who require high computing power for professional tasks.
Source: NewsData