The semiconductor industry is experiencing a shift as advanced packaging technologies gain prominence. Innovations in artificial intelligence, data centers, autonomous vehicles, and new chip architectures are influencing the development roadmap, with advanced packaging playing a critical role in meeting these evolving demands.
NEPCON 2026 highlighted this trend, attracting 78,673 exhibition visitors and 19,738 conference participants. The event underscored the increasing strategic importance of advanced packaging, which has become a central focus within the semiconductor sector.
**Why this matters**
Advanced packaging enhances chip performance, efficiency, and integration, enabling the development of more powerful and compact semiconductor devices. As industries like AI and autonomous vehicles expand, these packaging innovations are essential for supporting next-generation technologies and sustaining growth in the semiconductor market.