The semiconductor industry is experiencing a shift as advanced packaging technologies gain prominence. Innovations in AI, data centers, autonomous vehicles, and new chip architectures are influencing the semiconductor development roadmap, placing greater emphasis on packaging solutions. This trend was highlighted at NEPCON 2026, which attracted 78,673 exhibition visitors and 19,738 conference participants, reflecting the sector’s expanding significance.
Advanced packaging now stands at the forefront of semiconductor innovation, surpassing traditional areas of focus. The technology enables improved performance, power efficiency, and integration, addressing the demands of next-generation applications across multiple industries.
**Why this matters**
As semiconductor devices become more complex, advanced packaging plays a critical role in enhancing chip functionality and efficiency. This shift supports the growth of emerging technologies such as AI and autonomous systems, making packaging a key factor in the future competitiveness of the semiconductor market.